The new X-Series improves on the design of the existing phone plug by offering the thinnest available 1/4" plug with unique Neutrik chuck type strain relief on the market. The new plugs meet the most recent requirements for highest packing density, which is 15.88mm jack pitch.

TECHNICAL DATA

Electrical
Rated current: depends on mating connector
Contact resistance: depends on mating connector
Insulation resistance - initial: > 2 G Ohm
- after damp heat test: = 1 G Ohm
Dielectric strength: 1 kV dc

Mechanical
Wiring: solder terminals
Wire size: 1 mm / AWG 18
Cable O.D.: 4 - 7 mm
Solderability: complies with IEC 68-2-20

Materials
Shell ZnAl4Cu1, Ni or black Cr plated
Insulation: PA 6.6 30% GR
Contacts: CuZn39Pb3, 2  Ni (Su) or gold plated
Chuck: POM
Bushing: Polyamid PA6
Temperature range: -20 ℃ to +65 ℃